Plasma Chamber Technologies

We produce and support Trazar automated matching units, electrostatic chuck controllers, fixed matching units, and their various supporting products.

Automated Matching Unit (AMU)

An electronic sub-assembly used on process tools using plasma such as PECVD and Dry Etch. The process chamber circuit impedance must be managed to ignite and sustain this plasma much like a complex fluorescent light. Each match is designed specific to the process the tool supports. We are able to support all Trazar AMU designs. Customization and optimization is possible.

Name [Part #] [OEM Part #] [Process Tool]

10D-2 [2813-001] [914-92003-00 Rev 2] [Mattson Technology Aspen I & Aspen II]

10D-4,F7 [4032-002] [533-22801-00] [Mattson Technology Aspen III]

2-1 (V) [3944-001] [ 27-121645-00] [Novellus / LAM Research Sequel, Concept I & II]

10E-2 [3502-002] [27-118072-00] [Novellus / LAM Research Speed]

2-1(H) [2218-001] [27-032653-00] [Novellus / LAM Research Sequel, Concept I & II]

10D-1 [2741-001] [914-92003-00 Rev 1] [Mattson Technology Aspen I]

10D-4 [4032-001] [553-12708-00] [Mattson Technology Aspen III]

Electrostatic Chuck Controller (ECC)

An electronic subassembly controls the power applied when chucking and de-chucking a wafer from process chamber platens or pedestals. Process tools vary their pedestal design therefore each will have a different ECC.

Name [Part #] [OEM Part #] [Process Tool]

ECC 1-1 [61648-001] [27-034079-01] [Novellus/LAM Research SPEED]

ECC 1-1M [62733-001] [27-266302-00] [Novellus/LAM Research]

ECC 1-4F [62671-001] [27-153218-00] [Novellus / LAM Research Sequel]

ECC 3-2 [62683-001] [27-285547-00] [Novellus / LAM Research]

Speed Reactor Network (SRN)

Electronic subassemblies used to apply lower frequency (2 MHz) to enhance the performance of the plasma in process chambers. They differ from AMU by having a “fixed” match setting.

Name [Part #] [OEM Part #] [Process Tool]

SRN 1-2 [62266-001] [27-132651-00] [Novellus/LAM Research SPEED]

SRN 1A-1 [61631-001] [27-05666-00] [Novellus/LAM Research SPEED]